MagnaTran® 8 Radius Vacuum Robot

Wafer Fast Swap Vacuum Robot for Heavy Payload & Small Containment Applications

The dual arm MagnaTran® 8 Radius™ robot extends the benefits of MagnaTran field-proven direct drive technology to a tri-axial drive. In addition, the MagnaTran leverages proven SCARA arm technology to provide sub 4 second fast swaps within a small containment diameter. Both the tri-axial drive and the arm have been designed to accommodate heavier payloads.

The direct magnetic drive technology improves reliability by reducing the number of parts and eliminating the need for a dynamic seal for vacuum isolation. Elimination of the dynamic seal reduces friction, wear, tear and torque resulting in fewer failures. Elimination of stepper motors and/or transmission coupling mechanisms reduces vibration, particles, backlash and increases positional repeatability.

The fast swap arm, Time Optimal Trajectory™, continuous rotation and direct drive servo, with Brooks proprietary DSP controller provides higher throughput.

Key Features

  • High capacity direct drive technology with no dynamic seals, drive belts or cables
  • Proven > 12.8 Million MCBF reliability
  • Controls located in a remote enclosure up to 15 feet away from the drive
  • Patented Time Optimal Trajectory®
  • User-programmable robot access zones
  • CE and SEMI S2 compliant


  • High reach-containment ratio
  • Fast swap
  • High payload capacity
  • Low cost of ownership
  • UHV compatibility
  • Wafer & equipment safety
  • Global Service Organization
  • Meets international design and industry safety standards

User-programmable safety zones prevent possible collision during manual operation thus ensuring the safety of high-value wafers and process equipment. Comprehensive diagnostics are accomplished via a graphical user interface at a remote, modem linked service terminal. Error logging with prior events is time and date stamped.

Cycle counters are stored in non-volatile memory and critical performance characteristics are monitored and reported graphically. Multi-Sensor interfacing is accomplished via high speed PIO that enables direct interface to substrate sensors and other peripheral modules such as valves. Real-time information allows position referencing by edge sensing of moving components. The wafer presence may be referenced in macro sequences for safety purposes.